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Agreement to qualify Soitec technology for future 200mm SiC substrate production.
December 2, 2022
By: DAVID SAVASTANO
Editor, Ink World Magazine
STMicroelectronics and Soitec announce the next stage of their cooperation on silicon carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months. The goal of this cooperation is the adoption by ST of Soitec’s SmartSiC technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm. “The transition to 200mm SiC wafers will bring sub...
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